Packaging

Assembly and connection technology, where the chip is mechanically and electrically connected to the substrate, is known as packaging. The packaging protects the chip from damage, such as breakage or stress, and also against contamination. Packaging also enables the testing of chips (known good die) before packaging in a system.
The two main targets in semiconductor packaging are miniaturization and system speed.

In the field of assembly and connection technology, centrotherm has specialized in reflow soldering under vacuum conditions on inorganic substrates, such as silicon and ceramic joints and stamping-bending components. Reflow soldering is a remelting soldering process in which a solder deposit is left on the substrate. Remelting soldering processes include SMD soldering, laser soldering, resistance soldering and vacuum soldering.

centrotherm’s vacuum soldering systems enable voidless and fluxless reflow soldering, producing ultraclean solder joints.