VLO 6 & VLO 12

The centrotherm VLO 6 and VLO 12 vacuum soldering systems have been designed for Advanced Packaging and Power Semiconductor applications and achieve very high heating and cooling rates. The systems meet the highest demands of start-ups and R&D departments which use vacuum to achieve voidless soldering joints.
   
VLO 6 | VLO 12 is the small-size entry level system of the centrotherm VLO family with a 6 liter or 12 liter chamber volume, yet offering the full functionality like the other VLOs. With the VLO 6 | VLO 12, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.
   
This system is ideally suited for production facilities and start-ups which run fluxless and voidless soldering processes with various gas atmospheres (N₂, H₂ 100, N₂/H₂ 95/5). The centrotherm VLO 6 | VLO 12 optionally provides wet chemical activation with HCOOH or dry chemical activation with in-situ MW plasma for ultra clean soldering joints. Even lead free paste or pre-forms can be used without additional flux.
   
The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.

• process temperature up to 450°C
• excellent temperature uniformity
• heating ramp up to 250 K/min
• cooling rate up to 180 K/min
• vacuum level up to 10-⁵ mbar
• very short cycle time: less than 5 minutes

Applications

• Advanced Packaging
• Power Semiconductors
• Sealing
• Soldering

Note: centrotherm photovoltaics AG reserves the right to make changes in the product specifications at any time and without notice.

Movie

Papers
Vacuum soldering with hydrogen
Plasma supported soldering processes (RF, MW-Plasma)
Vacuum soldering with H₂O Plasma
Vacuum soldering using formic acid