Our product portfolio includes production systems for thermal processes, such as annealing, oxidation, diffusion, LPCVD, PECVD, epitaxy, soldering and packaging. They are successfully employed in the semiconductor industry worldwide, offering high-quality process results, low operating costs and maximum throughput.

Processes
Diffusion, BBr₃ doping, B₂H₆ doping, POCl₃ doping, H₂ and N₂ tempering, wet and dry oxidation (option: DCE, HCl), drying, activation tempering, silicide formation, nitrididation formation, contact sintering, polysilicon, doped polysilicon, silicon-nitride, oxinitride, TEOS, HTO, SIPOS and BTBAS.

Thanks to voidless and fluxless reflow soldering, our vacuum soldering systems offer ultra-clean solder joints for the following applications, among others: Power semiconductors, microelectronic hybrid modules, optoelectronic packaging, wafer level packaging, UHB-LED packaging, MEMS

Product overview